Features:
TCG Opal Encryption, TRIM support, Advanced Garbage Collection, thermal sensor, Power Shield, Advanced LDPC ECC Technology, intelligent advanced wear-leveling, 3K P/E cycles (Program/Erase cycles), Dynamic thermal throttling, Corner Bond technology, PCB gold finger, Read Disturbance, Early Move technology, 112-layer 3D NAND technology, Anti-sulfur technology, Extended Temperature, Advanced Encrypting Standard (AES), S.M.A.R.T.

Specification:
Capacity 128 GB
Depth 42 mm
Height 2.23 mm

Max Operating Temperature 75 °C
Max Storage Temperature 85 °C

Min Operating Temperature 20 °C
Min Storage Temperature 55 °C

Interface PCIe 3.0 x4 (NVMe)
NAND Flash Memory Type 3D multi-level cell (MLC)

Performance:
4KB Random Read 102000 IOPS
4KB Random Write 275000 IOPS
Internal Data Rate 2000 MBps (read) / 1700 MBps (write)