Transcends M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ- gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20degC~75degC.


Features:

30u- PCB Gold Finger
Corner Bond
Extended Temperature
Dynamic Thermal Throttling
Thermal Sensor
Read Disturbance
Anti-sulfur Technology
Garbage Collection
Wear Leveling
TRIM
Bad Block Management
Power Shield (PS)
Early Move

Specifications:
Dimensions 30 mm x 22 mm x 2.38 mm (1.18- x 0.87- x 0.08-)
Operating Temperature: -20°C (-4°F) ~75°C (185°F)
Storage Temperature -55°C (-67°F) ~ 75°C (167°F)
Humidity 5% ~ 95%
Sequential Read/Write (CrystalDiskMark):
Read: up to 2,000 MB/s
Write: up to 1,100 MB/s
4K Random Read/Write (IOmeter):
Read: up to 90,000 IOPS
Write: up to 220,000 IOPS